XC5VLX30-1FFG676I Programmable IC
Chip 676-BBGA Package FPGAs Flexible Configuration Options 1.05V
| Number of LABs/CLBs | | |
| Number of Logic Elements/Cells | | |
| Total RAM Bits | | |
| Number of I/O | | |
| Voltage - Supply | | |
| Mounting Type | | |
| Operating Temperature | | |
| Package / Case | | |
| Supplier Device Package | | |
| Base Product Number | |
XC5VLX30-1FFG676I Advanced DSP48E slices
− 25 x 18, two’s complement, multiplication
− Optional adder, subtracter, and accumulator
− Optional pipelining
− Optional bitwise logical functionality
− Dedicated cascade connections
• Flexible configuration options
− SPI and Parallel FLASH interface
− Multi-bitstream support with dedicated fallbackreconfiguration logic
− Auto bus width detection capability
• System Monitoring capability on all devices
− On-chip/Off-chip thermal monitoring
− On-chip/Off-chip power supply monitoring
− JTAG access to all monitored quantities
• Integrated Endpoint blocks for PCI Express Designs
− LXT, SXT, TXT, and FXT Platforms
− Compliant with the PCI Express Base Specification 1.1
− x1, x4, or x8 lane support per block
− Works in conjunction with RocketIO™ transceivers
• Tri-mode 10/100/1000 Mb/s Ethernet MACs
− LXT, SXT, TXT, and FXT Platforms
− RocketIO transceivers can be used as PHY or connect to external PHY using many soft MII (Media Independent Interface) options
• RocketIO GTP transceivers 100 Mb/s to 3.75 Gb/s
− LXT and SXT Platforms
• RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s
− TXT and FXT Platforms
• PowerPC 440 Microprocessors
− FXT Platform only
− RISC architecture
− 7-stage pipeline
− 32-Kbyte instruction and data caches included
− Optimized processor interface structure (crossbar)
• 65-nm copper CMOS process technology
• 1.0V core voltage
• High signal-integrity flip-chip packaging available in standard or Pb-free package options
